Through Hole 360°: The Evolution of Electronic Assembly Comes to SMTA GDL 2026
October 9, 2026
The demands of electronics manufacturing have led assembly lines to rethink processes that were considered conventional for years. In this context, through-hole technology (THT) faces the challenge of increasing speed, precision, and adaptability without becoming a bottleneck in production.
The answer lies in greater technology integration. Under the Through Hole 360° concept, automation can encompass different stages of the process, from component cutting and forming to THT insertion and wave or selective soldering.
At SMTA GDL 2026, this vision will be showcased at Booth 212, where Solucinde will present the ZSW EVOL wave soldering machine, a solution designed to bring greater control and flexibility to a critical stage of electronic assembly.
An Architecture Designed to Control Every Stage
One of the distinguishing features of the EVOL Series is its system of independent internal conveyors, structured into three stages: flux application, preheating, and soldering.
Unlike a traditional configuration, this architecture allows different speeds to be set for each module. As a result, adjustments made in the soldering zone do not alter preheating conditions, making it easier to optimize parameters according to the specific requirements of each process.
The advantage lies in control. By separating the three phases, manufacturers can fine-tune operating conditions without compromising the performance of the rest of the process. This feature is particularly relevant for production lines handling different products.
Automation Also Applies to Product Changeovers
Flexibility takes on another dimension when a single production line must handle different product variants. The ZSW EVOL incorporates a barcode reading system that enables automatic recipe changes.
Once the corresponding barcode is identified, the equipment can automatically adjust the flux application path and wave height. This reduces operator intervention, shortens production changeover times, and facilitates high-mix production.
This capability connects wave soldering with a broader trend in electronics manufacturing: integrating production equipment into increasingly automated processes designed for information exchange.
Less Flux, Greater Application Precision
The efficiency of a soldering process also depends on how consumables are managed. In this area, the EVOL incorporates a selective flux application system designed to apply flux only to the areas where it is needed.
The equipment can also be fitted with a Sono-Tek ultrasonic nozzle, developed in the United States. According to information provided by Solucinde, this technology eliminates splashing, promotes flux penetration into PCB holes, and can reduce flux consumption by up to 60%.
The result addresses two factors that are playing an increasingly important role in manufacturing decisions: operational efficiency and responsible resource use.
Beyond a Single Machine: The Through Hole 360° Approach
Solucinde's concept is based on a fundamental premise: optimizing through-hole assembly requires looking at the entire production chain, not just the soldering stage.
The solutions brochure showcases a portfolio that includes component feeding, radial and axial insertion, vision systems, force and position monitoring, MES connectivity, and automated PCB loading and unloading.
Some of its insertion solutions, for example, combine CCD cameras to identify hole positions with servo-driven mechanisms and real-time monitoring of variables such as insertion force and depth.
This integration makes it possible to approach through-hole assembly as a process that can be automated from end to end, using technologies that deliver precision, traceability, and adaptability.
The same approach extends to more specialized applications. The portfolio includes equipment designed for pin insertion in power modules, featuring 2D and 3D vision systems, force monitoring, and MES connectivity. These solutions target industries such as automotive, aerospace, communications, and new energy.
Through-Hole Technology at a New Stage in Electronics Manufacturing
The evolution of THT assembly is not solely about increasing machine speed. The challenge is to achieve more stable, flexible, and connected processes capable of responding to greater product diversity and increasingly stringent quality requirements.
In this context, solutions such as EVOL offer an approach in which automation is built around individual control of each process stage, reduced manual intervention, and more precise resource management.
For those interested in experiencing this technology firsthand, the ZSW EVOL will be available at Booth 212 during SMTA GDL 2026, where visitors can explore its capabilities and learn more about Solucinde's approach to through-hole assembly automation.
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